背景

Materials thickness measuring instrument testing machine

Film thickness measuring instrument adopts mechanical contact measurement method, strictly conform to the requirements of the standard, effectively ensure the normative and accuracy test. It is specialized in measuring the thickness of plastic film, thin film, diaphragm, paper, foil, silicon wafer and other materials within the range.

  • WLD
  • CHINA
  • 1-7DAYS
  • 100
  • Information

Application


Film thickness measuring instrument adopts mechanical contact measurement method, strictly conform to the requirements of the standard, effectively ensure the normative and accuracy test. It is specialized in measuring the thickness of plastic film, thin film, diaphragm, paper, foil, silicon wafer and other materials within the range.


Professional technology


1. Strictly in accordance with the standard design of contact area and measuring pressure, while supporting a variety of non-standard customization.
2. The measuring head rises and falls automatically during the testing process, effectively avoiding the systematic error caused by human factors.
3. Automatic and manual measurement modes are supported, which is convenient for users to choose freely.
4. System automatic injection, injection step, measurement points, injection speed and other related parameters can be set by the user.
5. Real-time display of the maximum, minimum, average and standard deviation of the measurement results and other analysis data for the convenience of users to judge.
6. The standard measurement block is used for system calibration to ensure the accuracy and data consistency of the test.
7. The system supports many practical functions such as real-time display of data, automatic statistics and printing, etc.,which can obtain test results conveniently and quickly.
8. The system is controlled by a microcomputer, equipped with LCD, menu-type interface and PVC operation panel,which is convenient for users to conduct test operation and view data.
9. Standard USB interface facilitates the external connection and data between the system and the computer.
Test range0~2 mm(Conventional) 0~6 mm/12 mm(Optional)
Resolution ratio0.1 μm
Measuring speed10 /min (Adjustable)
Test pressure17.5±1 KPa(Film)/50±1 KPa(Paper)
Contact area50 mm²(Film)/200 mm²(Paper)
Injection step distance0~1000 mm
Sample injection speedSample injection speed
Power supplyAC 220V 50Hz
Size461*334*357 mm
Weight32 kg

diaphragm and silicon wafer thickness measuring instrument


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